Foxconn to build 12-inch wafer fab plant in Malaysia; Hyundai and Kia investing US$16.5 billion to boost EV production in South Korea

This Asia tech industry summary will mainly focus on Foxconn planning to build a 12-inch wafer fab plant in Malaysia while deepening its deployments for MOSFET power semiconductors in Taiwan; and Hyundai and Kia initiating their plan to invest US$16.5 billion to boost EV production in South Korea by 2030.

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EIH works with Himax to develop e-paper driver IC solution

Electronic paper (e-paper) maker E Ink Holdings (EIH) has cooperated with display image processing IC design house Hiamx Technologies to develop an e-paper-use driver IC solution that features dynamic and interlaced scan technology to reduce latency in displaying digital handwriting by an average of 5.6ms, with AI-based computing to reduce power consumption by 40-60%, according to EIH.

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