While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with big investments by major players including TSMC, Samsung, Intel, ASE Technology and Amkor in the next decade. And TSMC is in pole position to outrace peers further through integrating its advanced manufacturing process nodes and 3D Fabric family of stacking and packaging technologies, according to industry observers.

面板厂彩晶去年底透过旗下投资公司买进背光模块厂中光电股票，累计持股9.78％，今年还获一席董事提名，彩晶董事长焦佑麒更有望进入中光电董事会。不过23日彩晶公告，因应国际经济情势及策略考量，决议废止取得中光电普通股案，短期不加码中光电股票。

近日，韩媒报道称，面板龙头京东方可能因更改了iPhone13的面板设计而被苹果要求停止供货，并将3000万台iPhone 14 OLED屏幕订单转移至其他厂家。