Powerchip Semiconductor Manufacturing Corporation (PSMC) and Japan’s financial firm, SBI Holdings, are reportedly planning to construct a 12-inch wafer fabrication plant in Japan. According to reports from Japanese media, this facility will be located in the industrial area near Sendai City in Miyagi Prefecture, northeastern Japan. The construction is scheduled to commence in 2024, with a target production start in 2026. The plant will primarily produce 55 to 28-nanometer chips, and the Japanese government will provide financial assistance.