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SEMI: global semiconductor packaging materials market to reach US$29.8b by 2027

Semiconductor Equipment and Materials International (SEMI), TECHCET, and TechSearch International jointly published “Global Semiconductor Packaging Materials Outlook” report on May 24, predicting that the size of global semiconductor packaging and assembly materials will increase from US$26.1 billion in 2022 to US$29.8 billion in 2027, at a compound average growth rate of 2.7%.