LG Electronics has secured its first order for laser direct imaging (LDI) equipment used in semiconductor packaging, marking an early commercial milestone as it expands into chip packaging.

China AIoT chip designer Rockchip posted record first-half 2026 results, with revenue rising 40.6% year on year to CNY2.88 billion (US$427 million) and net profit surging 61.73% to CNY859 million, supported by accelerating edge AI adoption.

China’s humanoid robot industry is entering a larger real-world test of AI, mobility and performance, with 2,056 robots set to compete in Beijing as domestic makers including Unitree Robotics accelerate development of faster and more capable machines.

VeriSilicon posted record first-half 2026 revenue of CNY1.86 billion (US$276 million), up 91.37% year-on-year, as AI computing demand lifted custom silicon and mass-production services.

TSMC is expanding cooperation with packaging and testing affiliate Xintec as it develops next-generation power delivery and advanced packaging for AI chips, while market speculation points to a broader outsourcing role for the company in CoWoS back-end assembly.

Taiwan is looking to Pittsburgh for lessons from Pittsburgh’s transformation into an AI and robotics hub as it develops technology clusters in southern Taiwan, with National Science and Technology Council (NSTC) Minister Wu Cheng-wen leading a delegation to the Pennsylvania city on August 13-14.