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PCM1601G Sunlight Readable Character LCD Module with LED Backlight, Blue on White
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Latest news and trends for industry
07
Jun
South Korea data center market to hit KRW11T by 2029
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Posted by
jeff
South Korea’s private data center market is set to expand rapidly as generative AI demand drives a global investment boom, with AI infrastructure, power supply, geographic dispersion, and data sovereignty reshaping the industry’s development path. Jong-hyun Shin, a researcher at the Korea Data Center Council (KDCC), said 2028 is expected to be the peak year for data centers finishing construction.
07
Jun
Zhen Ding posts strongest May revenue as server optical module shipments surge
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Posted by
jeff
Zhen Ding Technology Group reported that May consolidated revenue reached a 2026 high as robust demand for high-end AI products drove significant year-over-year growth, the company said. The firm attributed the performance to a sharp uptick in server and optical module shipments, which rose nearly 2.5 times year-over-year, and strong momentum in IC substrate sales, which grew nearly 80% year-over-year.
07
Jun
Pegatron unit ASRock Rack wins order to supply 587 GPU servers for Thailand AI data center
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Posted by
jeff
ASRock Rack, a subsidiary of Pegatron Group’s ASRock Inc., has won an order to supply 587 GPU servers equipped with Nvidia B200 accelerators to Japan-based AI infrastructure provider Datasection Inc., the two firms announced. The systems are contracted for deployment at Datasection’s AI data center near Bangkok, Thailand, and will serve as a dedicated high-performance computing platform for US companies.
07
Jun
Samsung Foundry turns to 5nm, 8nm orders as 2nm comeback takes shape
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Posted by
jeff
Samsung Electronics is pursuing a two-track foundry strategy, accelerating its 2nm push for future customers while asking partners to step up sales of its 5nm and 8nm processes to support near-term utilization, according to ZDNet Korea.
07
Jun
JCET opens 3D packaging plant to target AI power modules, CPO demand
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Posted by
jeff
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider’s push into advanced packaging for AI computing, power modules, and next-generation data centers.
07
Jun
BOE says glass-based packaging substrate pilot line has yet to reach mass-production yield
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Posted by
jeff
BOE Technology Group’s push into glass-based packaging substrates remains short of mass production, even as the Chinese display maker expands into new materials and advanced display technologies to build growth beyond conventional panels.