At the recently concluded GITEX AI Asia conference, executives from Nokia, AI chip innovator Blaize, and Indonesian telecom provider Datacomm discussed the evolution of AI infrastructure. In an exclusive interview with DIGITIMES, they highlighted that while training remains centralized in low-cost remote locations, inference architectures are rapidly shifting toward edge decentralization to enhance response times and data sovereignty.

Vietnamese Communist Party General Secretary and State President To Lam will pay a state visit to China from April 14-17, where he is set to meet Chinese President Xi Jinping. Against the backdrop of ongoing conflict in the Middle East, both sides are expected to prioritise energy security and expand bilateral trade cooperation.

Shanghai Dishan Technology has advanced its 2nm-class AI GPU into the prototyping stage, marking a rare push by a China-based designer into cutting-edge AI silicon — though manufacturing access and software readiness remain major hurdles.

Samsung Electronics has begun procuring semiconductor equipment for its P4 facility in Pyeongtaek, marking the transition of its planned 1c nanometer DRAM investment into the execution phase, according to South Korean media reports.

As generative AI demand shifts from centralized cloud training to edge inference, Nokia and AI chip startup Blaize have expanded their partnership in Singapore, unveiling a full-stack solution for hybrid heterogeneous computing at GITEX AI Asia.

As AI chips demand higher performance and denser integration, advanced packaging and substrate technologies have become critical in the semiconductor race. Samsung Electro-Mechanics (Semco) is reportedly establishing a new production line for multilayer ceramic capacitor (MLCC) embedded semiconductor substrates at its Vietnam facility to strengthen its position in the AI semiconductor supply chain.