MediaTek has completed pricing on US$3.9 billion of overseas convertible bonds, more than NT$120 billion and what the company says is the largest overseas CB ever issued in Taiwan’s capital market. Nvidia subscribed for US$3.5 billion of it — roughly 90% of the offering.

The Kuycon W34KB has been launched to the market, blending ultra‑high resolution with extreme refresh‑rate flexibility. The 34-inch Fast HVA display introduces a dual‑mode system that allows users to switch instantly between a 5K WUHD 5120 x 2160 mode at 180 Hz and a WFHD mode that reaches 360 Hz, giving the monitor a rare ability to serve both creators who need precision and gamers who demand…

According to OFweek Robotics, China’s National Development and Reform Commission (NDRC) has issued a clear warning to the country’s booming robotics sector: focus on practical applications and sustainable growth rather than blind speculation. Speaking at an August 28 press conference, NDRC spokesperson Chao Li called for a disciplined approach to development, urging governments and tech firms to build on local resource endowments and industrial strengths rather than blindly following trends.

The industrial PC (IPC) industry is entering a new AI-driven recovery cycle as artificial intelligence moves into a broader range of real-world applications. Market research estimates put global IPC output at about US$6.1 billion in 2025, rising to US$8.91 billion by 2030 — a compound annual growth rate (CAGR) of 7.9% that outpaces the broader PC industry.

The Executive Yuan’s proposed Special Act for Indigenous Defense Unmanned Vehicle Procurement failed to win approval in the Legislative Yuan, which instead adopted a version proposed by opposition caucuses, leaving a six-year, NT$240 billion (approx. US$7.6 billion) procurement framework facing uncertainty.

Demand for AI and high-performance computing (HPC) continues to drive semiconductor process development, with advanced nodes and advanced packaging entering a new cycle of capacity expansion. Gudeng chairman Bill Chiu said on August 31, 2026, that the company’s advanced packaging business is expected to post double-digit revenue growth from 2027 as global demand continues to expand.