Lightel Technologies reported record first-half results for 2026, with consolidated revenue reaching NT$590 million (US$18.7 million), net profit at NT$107 million, and earnings per share of NT$4.34. The Taiwan-based optical components maker said the gains came as shipments tied to low Earth orbit satellite projects continued to scale up.

Samsung Electronics launched its Galaxy S26 Fan Edition in the second half of 2026 with a starting price of 1.045 million won in South Korea, or about US$714, as it sought to round out its smartphone lineup and address rising component costs. According to ET News and Bloomberg, global sales of the 256GB model were set to begin on September 4.

India’s semiconductor ambitions are expanding from packaging and testing to chip design, materials, mobile devices and data centers. New investments by CG Power, Infineon, Foxconn, Samsung and LG highlight rising industrial activity, while skills shortages, environmental constraints and import dependence remain challenges. Government incentives increasingly seek deeper domestic capabilities and higher value creation.

Can Xiaomi’s in-house chip reach 2nm? Is HBM rerouting to Malaysia TSMC giving Intel a pass? Can Nvidia hold a 75% gross margin or protect market share? Ahead of Apple’s September 10 event, the pre-event technology lull was anything but quiet, and DIGITIMES analyst Luke Lin broke down three stories and the industry logic behind them.

China’s optical display industry is cooling after years of aggressive panel fab construction that has reshaped the global display landscape. Investments in China’s optical display sector fell 80.3% year-on-year in the first half of 2026, underscoring a slowdown in capacity expansion with capital now shifting toward optical materials and mini/micro LED (MLED) displays.

Universal Scientific Industrial (USI), part of ASE Technology Holding, is expanding its optical interconnect footprint for AI data centers. EugenLight Technologies, in which USI holds a controlling stake, has launched its ultra-high-power (UHP) external laser source form-factor pluggable (ELSFP) module series, targeting high-speed optical interconnect demand in next-generation AI compute clusters, high-performance computing (HPC), and high-density data centers, with mass production scheduled for the first quarter of 2027.