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Latest news and trends for industry
20
Jun
AI boom pushes Wistron to rapidly scale up server production
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Posted by
jeff
The demand for AI remains robust, and visibility is high. Wistron President and CEO Jeff Lin noted that most customers are placing rolling 12-month orders, and current demand is expected to remain strong through May 2026. How strong? According to Lin, Wistron’s newly completed AI Smart Campus in Zhubei is already expected to face capacity constraints by 2026.
20
Jun
SoftBank pitches US$1 trillion US AI hub to TSMC, Trump team
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Posted by
jeff
SoftBank Group Corp. founder Masayoshi Son is seeking to team up with TSMC to realize what could be his biggest bet yet — a trillion-dollar industrial complex in Arizona to build robots and artificial intelligence (AI).
20
Jun
GBM expands AI product line via Lincstech acquisition, focus on Singapore and Malaysia operations
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Posted by
jeff
Global Brands Manufacture (GBM), a PCB and EMS subsidiary of Walsin Technology, recently held a shareholders’ meeting led by chairman Yu-Heng Chiao to discuss acquiring Japan’s Lincstech. The deal aims to boost the company’s presence in AI servers, semiconductors and expand production in Singapore.
20
Jun
China to inject US$19 billion in consumer subsidies as trade-in policy expands
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Posted by
jeff
In a continued push to stimulate domestic demand, China is set to release an additional CNY138 billion (approx. US$19 billion) in the second half of 2025 to fund subsidies for its nationwide “old-for-new” consumer trade-in program. The policy covers a wide range of household and consumer electronics, including home appliances, kitchen and bathroom equipment, smartphones, and automobiles.
20
Jun
Wistron ITS enters chip design race with new semiconductor division
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Posted by
jeff
Wistron ITS (WITS), a subsidiary of the Wistron Group, has officially launched a new Semiconductor Business Unit, marking its strategic shift from traditional IT services toward integrated circuit (IC) layout design.
20
Jun
Taiwan chip packaging sector faces triple threat as Trump tariff deadline looms
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Posted by
jeff
Taiwan’s semiconductor packaging and testing companies confront three major operational challenges in the second half of 2025 as US President Donald Trump’s reciprocal tariff suspension expires in less than a month.