Rack-level delivery becomes a mainstream trend in cloud AI compute; MediaTek joins TPU design, influencing Taiwan’s IC design status.

JetCool, a subsidiary of Flex, has partnered with Broadcom to develop liquid cooling solutions for next-generation AI processors, according to a press release issued March 11. The collaboration aims to address rising thermal demands as AI chip power densities continue to increase.

Benefiting from the continued expansion of its artificial intelligence (AI) server business, Asustek Computer reported a record full-year net profit after tax of NT$44.56 billion (approx. US$1.40 billion) for 2025, up 42% year over year. Looking ahead to the first quarter of 2026, Asustek Chief Financial Officer Nick Wu said the server business will maintain strong growth, with revenue expected to rise 50% to 100% sequentially and quadruple to quintuple compared with the same period last year.

United Microelectronics Corporation (UMC) has partnered with startup HyperLight to mass-produce thin-film lithium niobate (TFLN) chiplets, aiming to improve data transmission speeds in artificial intelligence computing clusters and data centers.

Elon Musk announced a joint venture between xAI and Tesla on March 11 aimed at building a system capable of emulating the operations of other companies. The move comes as autonomous AI agents draw growing attention from leading tech companies — and concern from those who fear they could upend the software industry or displace white-collar workers entirely.

Samsung Electro-Mechanics (Semco) is expected to supply ABF substrates for Tesla’s next-generation artificial intelligence chips that Samsung Electronics plans to manufacture at its Taylor, Texas foundry, according to Chosun Biz and other Korean media reports.