Tata Electronics, the Indian contract manufacturer that assembles iPhones and supplies other global technology companies, has confirmed a cybersecurity incident after the extortion group World Leaks published more than 630 gigabytes of data taken from the company’s systems. The cache, posted on the group’s dark-web leak site, contains 204,341 files and folders drawn from Tata Electronics’ internal file servers.

China’s AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic substitution are driving a new capacity cycle.

Apple is reportedly considering adopting 1.4nm process technology for its flagship smartphone SoCs as early as 2028, implying that flagship chips built on the 2nm generation could have a lifecycle of only about two years.

Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNews and Yonhap reported.

A US$250 million award for I-Pulse’s semiconductor and pulsed power research could have implications far beyond the US, potentially affecting energy, mining, defense, and chip supply chains used by industries worldwide. The funding is aimed at domestic capacity, but the technologies being developed may shape global competition and access.

ShunSin, a Foxconn-affiliated packaging and testing company, held its 2026 annual general meeting, with chairman Shang-Yi Chiang presiding. Chiang said ShunSin will leverage its packaging, testing, and optoelectronic integration capabilities under Foxconn’s “3+3+3” strategy to seize advanced packaging opportunities in AI optical communications.