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Latest news and trends for industry
24
Jun
SK Hynix to issue $29 billion in new shares for Nasdaq ADR listing on July 10
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Posted by
jeff
SK Hynix disclosed in regulatory filings to South Korea’s Financial Supervisory Service and the Korea Exchange on June 24 that its board has approved the issuance of new shares worth 45,453,450,000,000 won (approximately $29.4 billion) to support a listing of American Depositary Receipts on the Nasdaq Global Select Market. The filings represent the company’s formal confirmation of a listing plan that market rumors had pointed to since at least December 2025, when SK Hynix first received and responded to regulatory inquiries about the speculation.
24
Jun
Imoo overtakes Samsung to become No. 4 smartwatch brand
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Posted by
jeff
Imoo beat Samsung Electronics, Oppo, and Garmin to rank as the world’s No. 4 smartwatch brand in global smartwatch sales in the first quarter of 2026. In fact, imoo’s global smartwatch shipments have matched Samsung’s in recent years, according to Counterpoint.
24
Jun
SoftBank to build domestic AI server base as Japan pushes for sovereign compute
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Posted by
jeff
SoftBank, the telecom arm of SoftBank Group (SBG), is moving to localize a larger part of Japan’s AI infrastructure stack, with plans to begin domestic AI server production in fiscal 2027 at the former Sharp Sakai plant in Osaka.
24
Jun
Asia’s AI data center boom turns green power into supply chain stress test
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Posted by
jeff
Asia’s AI infrastructure buildout is turning electricity into a new supply chain constraint. As demand for data storage, compute power, high-performance memory, servers, and advanced semiconductor manufacturing accelerates, governments and technology companies are under pressure to secure not only more power, but cleaner and more reliable power.
24
Jun
Global market for advanced chip packaging set for rapid expansion
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Posted by
jeff
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global readers, the shift could shape future device performance, supply chains, and where advanced semiconductors are manufactured and assembled.
24
Jun
China’s LineShine supercomputer tops TOP500, but AI lead remains unclear
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Posted by
jeff
China’s LineShine supercomputer debuted at No. 1 on the June 2026 TOP500 list, announced at the ISC 2026 conference in Hamburg, becoming the first system to sustain more than two exaflops on the standard HPL benchmark using CPUs only. The result marks the first time since 2017 that a China-based system has led the TOP500 ranking, and reflects Beijing’s effort to present a frontier computing system built around domestic processors, interconnects, and software.