Synopsys chief product development officer Shankar Krishnamoorthy said AI will accelerate the electronic design automation (EDA) industry as the company works with OpenAI to develop semiconductor-specific models, while maintaining support for both frontier and open-weight models to preserve platform neutrality.

AUO Mobility Solutions Corporation, a subsidiary of AU Optronics (AUO) focused on smart cockpit and mobility solutions, will showcase its latest advances at CES 2027 in Las Vegas under the theme “Intelligence in Motion,” highlighting the shift from visual experiences to intelligent interaction.

As AI applications expand from cloud model training to end devices, Foxconn is using fan-out redistribution layer (RDL) technology to enter the advanced packaging market. The company showcased approximately 5μm-class fine-line circuitry at Hon Hai Tech Day 2026, targeting automotive chiplets, edge AI, and consumer electronics by balancing interconnect density, package size, and manufacturing cost.

Sustainable energy company Hengs Technology has partnered with printed circuit board (PCB) maker Unitech Printed Circuit Board to launch a large behind-the-meter energy storage project at Unitech’s Yilan plant in Taiwan, as demand for stable power and energy cost management rises among high-consumption industries driven by AI, high-performance computing (HPC), and electronics manufacturing expansion.

Xilect, a robot-chip venture set up by Chinese GPU designer MetaX and humanoid robot maker UBTech Robotics, has completed a CNY500 million (US$74.76 million) angel round to build a domestic computing platform for embodied AI, with Nvidia’s Thor as its benchmark.

Japan’s Hoya has reportedly told Samsung Electronics it would struggle to meet the chipmaker’s request for additional extreme ultraviolet (EUV) mask blanks in 2027.