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Latest news and trends for industry
20
May
ASML to deliver first High-NA chips within months despite cost concerns
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Posted by
jeff
ASML expects its first advanced semiconductors made using next-generation High-Numerical Aperture (High-NA) extreme ultraviolet (EUV) lithography equipment to ship within months.
20
May
Apple unifies hardware Silos to accelerate post-Cook device development
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Posted by
jeff
Apple’s new Chief Hardware Officer, Johny Srouji, has launched a reorganization of the company’s device development division. The move shifts executive responsibilities over core product design to accelerate future hardware cycles. According to Bloomberg, the changes integrate the previously independent domains of hardware engineering and hardware technologies under a single leadership structure. The realignment is part of a broader succession plan, following Apple’s announcement that John Ternus — longtime senior vice president of hardware engineering — will become Chief Executive Officer on September 1, 2026.
20
May
SpaceX to purchase Cursor one month after potentially record-breaking IPO
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Posted by
jeff
SpaceX plans to follow through with its acquisition of Cursor, which provides AI coding tools, 30 days after the space company launches its IPO. The deal, worth US$60 billion, would shore up SpaceX’s recently acquired xAI unit, whose Grok models are reportedly considered to be behind those of competitors Anthropic and OpenAI.
20
May
Alibaba’s T-Head doubles down on AI infrastructure with Zhenwu M890
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Posted by
jeff
Alibaba Cloud has unveiled the Zhenwu M890, a new proprietary AI training and inference chip developed by its semiconductor subsidiary T-Head Semiconductor, as the Chinese cloud group accelerates its push into full-stack AI infrastructure for the agentic AI era.
20
May
Tech Forum 2026: AI server racks push liquid cooling into mainstream
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Posted by
jeff
META Green Cooling Technology (MGC) president Clyde Chu said Nvidia’s chip roadmap shows that cooling requirements are doubling in less than a year, with the NVL72 rack based on the Vera Rubin architecture, expected in the second half of 2026, requiring 130-140 kW of cooling capacity per rack. By 2027, the Vera Rubin Ultra platform could push single-rack power consumption to 200-300 kW.
20
May
Microsoft advances India data center timeline within expanded regional investment framework
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Posted by
jeff
Microsoft’s data center expansion in India represents the continuation of a strategic regional investment trajectory, updating previously announced capital commitments rather than introducing new funding. The company is accelerating infrastructure deployment in India’s fast-growing AI market, where it competes with Alphabet and Amazon for dominance in cloud services and artificial intelligence.