Smartphone shipments by Chinese brands are estimated to decrease by 8.2% year-on-year in the first quarter of 2026; smartphone shipments in the Chinese market will decrease by 6.5% year-on-year.

The US Department of War has invited 25 companies to compete in the first phase of a major initiative to deploy low-cost, weaponized one-way attack drones at scale. The move is part of a broader effort to overhaul the military acquisition system and counter the rising influence of unmanned systems on the battlefield.

Advanced Micro Devices (AMD) expects to continue growing its PC business in 2026 even as elevated component prices are projected to weigh on the broader industry, according to comments from CEO Lisa Su on the company’s February 3, 2026, earnings call. During the call, Su detailed a strategy focused on enterprise customers and the premium segment to offset anticipated market headwinds.

HP announced today that Bruce Broussard, who has served on the company’s board of directors since 2021, has been named interim chief executive officer, effective immediately. He succeeds Enrique Lores, who is stepping down as president, CEO, and board member to pursue another professional opportunity. The board has established a CEO search committee and retained a leading global executive search firm to assist in identifying Lores’s permanent successor.

Texas Instruments (TI), Infineon Technologies AG, STMicroelectronics, and NXP Semiconductors are expanding their manufacturing footprint in Malaysia as global customers accelerate efforts to diversify production away from China. The shift is being reinforced by rising electricity consumption from AI data centers, which is driving demand for high-voltage, high-power power management components used in servers and related infrastructure.

SK Hynix is accelerating production of 1b DRAM for high-bandwidth memory as quality testing of Nvidia’s next-generation HBM4 nears its final stage, according to Korean media and industry sources.