Zhonghao Xinying (Hangzhou) Technology has launched its new self-developed high-performance TPU AI processor, Xuyu, alongside Taize 2.0, a software-hardware integrated AI computing platform built around the chip.
Samsung Electro-Mechanics signed a final agreement on July 2 with Sumitomo Chemical’s Korean subsidiary Dongwoo Fine-Chem to form a joint venture that will produce glass cores, a key material used in next-generation semiconductor package substrates, the companies said.
The AI boom is reshaping global supply chains and accelerating manufacturing’s shift toward smarter operations. Tong Ming, the world’s largest single stainless-steel fastener maker, said it will invest about NT$140 million (US$4.4 million) in the second half of 2026 to automate a semi-finished goods warehouse at its Changsheng plant, while strengthening automation, digital management, and precision services to boost competitiveness and address challenges from the EU’s Carbon Border Adjustment Mechanism (CBAM) and supply-chain restructuring.
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