02
Jun
02
Jun
MSI MEG X redefines gaming monitors with agentic AI and a 360Hz Penta Tandem QD‑OLED panel
02
Jun
The 5K dual-mode MSI MAG 271KPD7 appears at Computex 2026, will launch around July
02
Jun
Interview: Agentic AI moves from copilot to co-worker in enterprise procurement— Pactum’s case for autonomous execution
Agentic AI is reshaping corporate procurement by moving beyond decision support to autonomous execution. Pactum is using it to automate tasks such as requisition handling, supplier communication, and compliance checks, helping enterprises manage procurement more efficiently across large supplier networks.
02
Jun
Commentary: Will AI sink or save the planet?
AI holds enormous potential to benefit the environment, but it simultaneously consumes massive amounts of water and energy. One generative AI data center can use up to 5 million gallons of water a day, and AI as a whole draws as much power as 100,000 households. A single AI query can use up to 1,000 times more electricity than a traditional Google search. The result is an urgent paradox: AI is becoming one of the most sophisticated tools ever built to combat climate change, yet it is also one of the fastest-growing strains on the planet’s resources.
02
Jun
Chinese brands fight for global trust amidst geopolitical turbulence
Chinese consumer electronics and tech brands have made significant strides in quality and innovation over the past few years, yet trust remains a persistent challenge in Western markets. Ongoing geopolitical tensions and media framing have added further complexity to that dynamic.
02
Jun
India’s corporate giants race to build backbone of its AI economy
India’s biggest business groups are ramping up spending on digital infrastructure, with Reliance Industries and Adani Group focusing on data centers, energy, and artificial intelligence. Their plans point to a wider shift in the Indian industry toward building the infrastructure needed for AI domestically.
02
Jun
Huawei’s Tau Law faces its hardest test: chip yield, not theory
Huawei has introduced Tau Law, a semiconductor design framework built around LogicFolding, as a potential route for China to improve chip performance under US technology restrictions. The idea is to shorten critical signal paths and extend gains as Moore’s Law slows, but its commercial value will hinge on yield, cost, and heat dissipation — not theory.
02
Jun
Analysis: Advanced packaging shifts from TSMC dominance to industry collaboration
Nvidia CEO Jensen Huang has repeatedly backed TSMC’s price hikes, saying its advanced process and supply-chain services are difficult and highly valuable. As AI chip demand surges, TSMC, Samsung Electronics, SK Hynix, Micron, and other top semiconductor makers are also reshaping their supply-chain strategy to deepen cooperation on mature-node foundry services and advanced packaging.
02
Jun
Commentary: Intel turns AI packaging crunch into foundry comeback test
Intel’s foundry revival may depend less on beating TSMC at the most advanced process nodes than on whether it can turn AI-driven demand into a profitable advanced packaging business.