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Latest news and trends for industry
20
Mar
The 2026 Hisense CanvasTV are launched in the U.S. under the Hisense S7SG series
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Posted by
jeff
20
Mar
Intel pushes large-area AI packaging to close foundry gap
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Posted by
jeff
Intel is reportedly preparing large-area AI chip packaging to strengthen its foundry business and challenge TSMC and Samsung Electronics.
20
Mar
Lumotive creates world’s first 2D photonic beamforming chip
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Posted by
jeff
Lumotive, a pioneer in programmable optical semiconductor technology, has demonstrated the world’s first programmable two-dimensional (2D) photonic beamforming chip. Built on its Light Control Metasurface (LCM) architecture, the chip enables electronic control of light across two dimensions within a single device — a capability long pursued in optical science and widely considered essential for scalable programmable optical systems.
19
Mar
New Chinese AI service startup analysis
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Posted by
jeff
Zhipu and MiniMax’s rapid revenue growth but expanding losses highlight that Chinese AI service startups will face severe elimination challenges in 2026.
19
Mar
Nvidia hosts Taiwan night at GTC 2026, Huang vows to defend Taiwan
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Posted by
jeff
Nvidia’s GTC 2026 is well underway, with the event reaching a record scale as among the major annual events in the AI landscape. Despite a packed schedule, CEO Jensen Huang attended the conference’s “Taiwan Night” on March 18 (local time) to engage with Taiwanese partners and express his appreciation for their work.
19
Mar
Analysis: GTC 2026 widens US-China AI compute gap
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Posted by
jeff
The annual Nvidia GTC conference has become a global barometer for the artificial intelligence (AI) industry. In a nearly two-hour keynote, Nvidia CEO Jensen Huang laid out a clear vision for AI’s future: a shift in focus from model and algorithm competition to competition over computing power, efficiency, and commercial deployment.