Under the AI boom, microLED optical communication is expected to become a key opportunity for the display industry’s transformation.

Phison Electronics posted record earnings in April as the artificial intelligence boom and tightening NAND flash supply drove memory prices sharply higher, underscoring the growing influence of AI demand across the semiconductor storage industry.

With surging demand for artificial intelligence, high-performance computing, and custom AI chips, MPI Corporation said strong momentum in semiconductor testing equipment and testing interface products drove another record quarter, underscoring the rapid expansion of AI-related chip validation demand across the industry.

TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities worldwide. At its 2026 Technology Symposium, TSMC vice president Bor-Zen Tien detailed the company’s latest progress in advanced process nodes, 3DFabric advanced packaging, global expansion, and AI-powered smart manufacturing.

IC design firm QBit Semiconductor will list on the Emerging Stock Board on May 15, 2026, and chairman Simon Shen, a former Kinpo executive, said the debut marks a new milestone for the company and underscores a promising growth outlook.

TSMC held its annual technology symposium in Hsinchu on May 14, 2026, after its North America stop, with executives noting that AI applications are rapidly expanding from cloud data centers to edge devices — driving surging demand for semiconductor compute density, high-bandwidth connectivity, power efficiency, and thermal management. Ray Wan, director of Asia-Pacific business, said TSMC will leverage advanced process technology and advanced packaging to help customers accelerate innovation in the AI era.