LG has launched the LG MAGNIT Active Micro LED, a cutting-edge home cinema display that leverages Active Matrix technology for pixel-level precision. This next-gen screen delivers stunning clarity, contrast, and depth, elevating the premium viewing experience to new heights. Rolling out in Korea on October 21 and expanding to major markets like North America, the MAGNIT Active Micro LED joins…

Myson Century has added Winho Tech to its portfolio, coming hot on the heels of its acquisitions of Y-S Electronic and Great Computer Corporation (GCC). Going forward, Myson Century and Winho will collaborate on digital technology, enterprise network applications, and AI smart applications, integrating cross-platform resources at parent company Sun Yad Group to drive intelligent transformation across the corporate group.

The Trump administration has enacted a dual trade policy under Section 232 of the Trade Expansion Act, imposing tariffs on imported medium- and heavy-duty trucks and buses while maintaining existing exemptions for automobiles. The tariffs aim to bolster domestic manufacturing competitiveness and reshape the US automotive supply chain.

Fifty-five iPhone and iPad users in China have filed a joint complaint with the State Administration for Market Regulation (SAMR), accusing Apple of abusing its dominant position by requiring all app transactions to go through its official App Store. The complaint also challenges Apple’s mandatory in-app purchase (IAP) system, which imposes commissions of up to 30%, according to Reuters and Sina.

Chinese smartphone shipments reached 177 million units in the third quarter of 2025, and shipments are expected to increase by 7.5% quarter-on-quarter in the fourth quarter.

The Global Electronics Association (GEA) participated as a co-organizer in the 2025 International Microsystems, Packaging, Assembly, and Circuits Technology (IMPACT) Conference, hosting a special forum, “Component to System-Level Integration.” The session brought together leading companies, including AMD, ASE Group, Kinsus, and Wistron, to discuss the development and standardization needs of advanced packaging technologies in the AI era.