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Latest news and trends for industry
22
May
AMD deepens Taiwan supply chain ties with US$10B-plus push
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Posted by
jeff
AMD CEO Lisa Su arrived in Taiwan on May 20, 2026, on a private jet and largely followed the same itinerary as her April 2025 visit, including a meeting with TSMC, a technology forum and dinner with Taiwan supply chain partners, and an about one-hour summit forum. This time, AMD also made the rare announcement that it will invest more than US$10 billion in Taiwan’s industrial ecosystem to accelerate AI infrastructure buildout.
22
May
US-Japan cooperation could protect Taiwan ‘99%’, defense investors told at Silicon Valley summit
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Posted by
jeff
Taiwan’s semiconductor industry and the military implications of a potential cross-strait conflict dominated the aerospace and defense track on the second day of the Plug and Play Silicon Valley May Summit, as investors and defense technology executives described a geopolitical environment that is fundamentally reshaping where capital flows and why.
22
May
Intel’s foundry reset: 14A, 10A and tougher engineering rules
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Posted by
jeff
Intel CEO Lip-Bu Tan is reshaping the chipmaker’s engineering culture and foundry strategy, confirming that 14A remains on track while revealing that early development has begun on next-generation 10A and 7A nodes.
22
May
Far EasTone eyes 2027 Amazon Leo launch to strengthen Taiwan network resilience
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Posted by
jeff
Far EasTone has secured Taiwan distribution rights for Amazon Leo, Amazon’s low Earth orbit (LEO) satellite internet service formerly known as Project Kuiper, positioning the telecom operator to add satellite connectivity as a backup layer for its mobile and fixed-line networks.
22
May
Lam Research launches PLP Center of Excellence, replacing wafers with panels
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Posted by
jeff
Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology has drawn significant industry attention. Global semiconductor equipment manufacturer Lam Research announced the official establishment of its PLP Center of Excellence (CoE) in Salzburg, Austria, aimed at strengthening PLP process R&D capabilities and driving scalable manufacturing solutions to meet advanced packaging demands in the AI era.
22
May
Tech Forum 2026: AI agents drive Arm CPU demand surge; 2026 shipments expected to exceed 6 million units
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Posted by
jeff
On May 20, 2026, DIGITIMES held its Tech Forum, where senior analyst Jim Hsiao delivered a presentation, “AI server market outlook and trends amid the explosion of agent applications.” In it, Hsiao explained that demand is rising sharply not only for x86 server CPUs from Intel and AMD, but also for Arm-based CPUs, which are expected to see explosive growth in 2026.