Ventec International said May 2026 revenue kept growing, driven by sustained demand for high-margin aerospace polyimide (PI) materials, the start of mass production after high-speed material certifications, and record-high sales of non-flow PP sheets. The copper-clad laminate (CCL) maker also benefited from strong demand for high-end drilling applications and a rising European distribution business, lifting revenue across its niche businesses.

Foxconn chairman Young Liu met SK Group chairman Chey Tae-won on June 3, as the two companies explore broader cooperation in AI servers, data centers, and energy solutions.

Samsung Electronics’ decision to place a key image sensor production line under its System LSI division highlights a broader question facing the CMOS image sensor (CIS) industry: whether chip designers should own manufacturing capacity or rely on external foundries as competition intensifies across smartphones, automotive systems, and AI-enabled devices.

TSMC chairman C.C. Wei spoke at a media briefing on June 4, 2026, after the company’s shareholders’ meeting. South Korea’s push to build a semiconductor cluster, Arizona’s efforts to establish a supply chain ecosystem, and Nvidia CEO Jensen Huang’s recent trip to South Korea were all topics of discussion.

Tripo AI said it has completed its Series A+ and Series A++ financing rounds, raising nearly US$200 million as it pushes deeper into AI 3D foundation models and world models.

Server chassis maker Chenbro is continuing to evolve, aiming to perfect the craftsmanship of mechanical components to become the world’s top rack supplier, according to company CEO Corona Chen.