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群创携手Manz攻扇出型面板级封裝

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28 Aug
德国设备制造商Manz集团积极抢扇出型面板级封装市场，陆续打入群创、力成等台厂供应链，提供面板级封装重布线层（RDL）量产线，助攻台厂抢商机。
Newer Inventec agrees to sell ZT Systems to AMD, to become AMD’s shareholder
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Older IDC调高2024全年手机交付预测：同比增长5.8%，AI手机将占18%