Taiwan’s offshore wind maritime engineering firm Dong Fang Offshore (DFO) is set to transition from the over-the-counter (OTC) market to the Taiwan Stock Exchange mainboard in mid-November 2025. The company is rapidly expanding its fleet to capture strong growth opportunities in AI-fueled undersea communication cable demand.

Sanyang Motor (SYM) officially unveiled its PE3 range-extended electric scooter technology on October 21, marking a new chapter in two-wheeler electrification. With the electric scooter industry currently facing a number of development bottlenecks, the company is positioning the PE3 hybrid system as the most pragmatic transitional technology toward full electrification.

Inventec, a leading Taiwanese original design manufacturer (ODM), has entered a joint venture with India’s Dixon Technologies to produce notebooks (NB), servers, desktops, and electronic components domestically. The new company, Dixon IT Devices Private Limited, will be majority-owned by Dixon (60%), with Inventec holding 40%. The jointly operated factory is scheduled for completion by the second quarter of 2026.

SK Hynix??s oligopolistic advantage in HBM had diminished in the third quarter of 2025, and memory competition will expand from HBM to next-generation products.

Samsung Electronics’ Device Solutions (DS) division CTO Song Jae-hyuk expressed strong confidence in the revival of Samsung’s foundry business and reported smooth progress on the company’s 2nm process during a semiconductor industry briefing hosted by South Korea’s chief presidential secretary for policy, Kim Yong-beom.

Samsung Electronics and SK Hynix unveiled their next-generation high-bandwidth memory (HBM4) at SEDEX 2025 in South Korea, marking Samsung’s first public display of an HBM4 sample domestically. The launch drew strong attention as the two memory leaders showcased contrasting strategies for the next stage of AI memory development.