US-based xMEMS Labs has developed the XMC-2400 µCooling™, a single-chip (SoC) air-cooled all-silicon active cooling solution utilizing semiconductor micro-electro-mechanical systems (MEMS) technology. This innovative chip, acting like an “ice jacket” for AI chips, can be customized in size and intelligently controlled to meet specific cooling needs.
xMEMS unveils revolutionary cooling SoC for AI devices
21
Aug