Powerchip Semiconductor Manufacturing Corporation (PSMC) announced on November 28 the launch of its Tongluo facility in Miaoli, central Taiwan, equipped with advanced interposer production and 3D wafer stacking capabilities. This new fab, with a monthly capacity of 40,000 12-inch wafers, positions PSMC to deliver high-margin 3D AI foundry services, enabling global clients to capitalize on the accelerating growth of the AI sector.