Polarizer specialist Cheng Mei Materials Technology (CMMT) is collaborating with customers on films, adhesives, and coatings for the fan-out panel-level packaging (FOPLP) backend manufacturing process. The company has made the initial step into the redistribution layer first (RDL-first) manufacturing process, primarily targeting applications such as power ICs and radio frequency integrated circuits (RFIC). Samples are currently being sent, with mass production pending customer validation.