Tong Hsing Electronic, a semiconductor packaging service and substrate provider, has forecast a mid single-digit quarter-over-quarter decline in revenue for the first quarter of 2025 due to seasonal weakness. Looking ahead to the full year, Tong Hsing president Heinz Lu pointed out that due to geopolitical factors, automotive customers remain conservative. But he is optimistic about the future growth momentum for ceramic substrate modules and the fiber optic communications segment in the RF module product line.