On March 24, 2025, Jiufengshan Laboratory (JFS) announced two major breakthroughs in GaN technology: the world’s first 8-inch silicon-based N-polar gallium nitride on insulator (GaNOI) material with high electron mobility, and the debut of China’s first 100nm GaN process design kit (PDK) for chip fabrication.
China breaks ground in GaN: first 8-inch N-polar wafer, 100nm PDK signal high-frequency chip ascent
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Mar