With the escalating global trade tensions and fresh US tariffs rattling the semiconductor sector, the underlying momentum in high-performance computing (HPC) and AI applications remains undeterred. Particularly, the ramp-up in 2-nanometer process production and sustained demand for advanced packaging technologies are fueling optimism among materials distributors. As a result, the traditionally slow first quarter of 2025 defied expectations, with industry players anticipating a strong second quarter as well.
AI and advanced chipmaking drive robust growth in semiconductor materials
14
May