The protracted dispute between Hanmi Semiconductor and SK Hynix regarding the supply of Thermo Compression Bonding (TCB) equipment has reached a resolution, with Hanmi Semiconductor confirming the return of its engineering personnel to SK Hynix’s facilities. This marks a significant thaw in the strained relationship between the two industry giants, following a month-long absence of Hanmi’s engineers from SK Hynix’s production lines.