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Samsung delays HBM4 rollout to 2026 due to yield challenges, all while SK Hynix strengthens lead in AI memory

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24 Jul

Samsung Electronics is reportedly pushing back the mass production of its next-gen high-bandwidth memory (HBM) chips to 2026, signaling a more cautious rollout amid ongoing DRAM redesign efforts.

Newer Malaysia unveils green data center rules to court foreign investors
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