Following Nvidia’s announcement to initiate a revolution in AI server power technology, with plans to fully implement 800V high-voltage direct current (HVDC) power architecture designs by 2027, semiconductor testing, packaging, and wafer thinning company Micro Silicon Electronics highlighted that this trend will become a new highlight for gallium nitride (GaN) end applications. Once mass production officially ramps up, the third category semiconductor testing business is expected to experience robust growth.