In response to the global surge in large-scale AI computing power deployment, the usage and value of PCBs for AI servers have significantly increased. High-end copper-clad laminate (CCL) is evolving as next-generation AI servers upgrade their transmission architecture to 1.6 terabit rates. With increasingly stringent demands for high-frequency, high-speed, and low-loss materials, board requirements are expected to officially advance from M7 and M8 grades to the M9 grade.