The global market for high-end cloud AI accelerators is approaching a major turning point. DIGITIMES forecasts that beginning in 2026, the supply chain will enter a new “decentralized” phase shaped by three forces: the expansion of custom ASICs, diversification of advanced packaging, and intensifying competition in high-bandwidth memory (HBM) pricing.
Research Insights: ASICs, packaging, and HBM reshape the AI chip race
04
Sep