On September 11, Chinese media reported that Huawei’s semiconductor unit HiSilicon has entered a new leadership phase. Eric Xu resigned as chairman, with Jeffrey Gao assuming the role. Huawei senior executives Ken Hu, Guo Ping, and Steven Ren also stepped down from their directorships, leaving He Tingbo — HiSilicon’s president and long-time steward — as the sole continuing board-level figure. He Tingbo also holds multiple senior posts at Huawei, serving as Director, Chair of the Huawei Scientist Committee, ITMT Director, and President of the Semiconductor Business Department.