At Xiaomi’s 2025 annual conference, founder Lei Jun spoke with calm restraint about the company’s self-developed Xring O1 chip. Yet beneath that composure were moments of risk and suspense: the US$20 million bill for the first TSMC 3nm tape-out, engineers guarding chip samples in an unmarked paper bag at the airport, and the late-night message, “system lit up.” When Lei answered his first call powered by the Xring O1, the wave of emotion was indescribable, the kind only insiders could fully understand.