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Samsung’s HBM4 logic die yield reportedly surpasses 90% ahead of Nvidia final tests

Samsung Electronics is preparing to enter the final quality testing phase for Nvidia’s sixth-generation high-bandwidth memory (HBM4), as its foundry division ramps up wafer production of the logic dies. Industry sources cited by media outlets including Chosunbiz and G-enews report that Samsung Foundry’s 4nm process logic die yield has exceeded 90%, signaling readiness for mass production.