As AI computing power rapidly scales, electronic system interconnect demands are shifting from traditional terminal structure optimization to comprehensive integration of high-speed signal integrity, high-power delivery, and system-level thermal management. Connectors and cables have become critical bottlenecks defining the performance limits of AI servers and edge devices. Connector and cable supply chain players say design capabilities involving materials, plating, shielding, and thermal coupling are emerging as core barriers for vendors aiming to enter the high-end market.