At the upcoming International Solid-State Circuits Conference (ISSCC) 2026 in February, Samsung Electronics and SK Hynix are set to unveil significant advances in high-performance memory. Samsung plans to showcase a redesigned 6th-generation high-bandwidth memory (HBM4) delivering 3.3TB/s of bandwidth, while SK Hynix will introduce its latest high-speed LPDDR6 and GDDR7 products.