Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip packaging capacity will consolidate around two critical hubs: Taiwan and the United States. The key beneficiaries are expected to be ASE Holdings and Siliconware Precision Industries (SPIL) in Taiwan, and Amkor Technology in the US and South Korea.