As 2025 nears its end, negotiations over the US Section 232 tariffs closely tied to Taiwan’s semiconductor and ICT exports remain unresolved. The US government’s expectation of a “50-50 chip split” has yet to receive a commitment from Taiwan. However, Taiwanese President Lai Ching-te recently sent a positive message in an interview with US media, stating that Taiwan is willing to assist the US in chip production, and that if the US provides policy support, achieving the “50-50 chip split” goal is possible. This marks a significant shift in the government’s stance toward US expectations based on mutual benefits.