SK Hynix plans to invest KRW19 trillion, about US$12.9 billion, to build an advanced semiconductor packaging plant in Cheongju, South Korea, as it moves to secure capacity for AI-driven memory demand. The investment would add to existing packaging operations in Icheon and a planned facility in Indiana, creating a network spanning South Korea and the US.
SK Hynix accelerates advanced packaging from Korea to Indiana
18
Jan