Memory packaging giant Powertech Technology is aggressively expanding into fan-out panel-level packaging (FOPLP), with chairman Duh-Kung Tsai optimistic about the AI industry. Amid ongoing memory shortages and rising demand for advanced packaging, Powertech aims to become the top partner outside the TSMC ecosystem, expecting a significant revenue surge in 2027-2028 as FOPLP capacity reaches full utilization, contributing NT$3 billion (US$95 million) monthly.