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TI and NXP report strong results as AI data center power management boosts semiconductor packaging demand

Texas Instruments (TI), Infineon Technologies AG, STMicroelectronics, and NXP Semiconductors are expanding their manufacturing footprint in Malaysia as global customers accelerate efforts to diversify production away from China. The shift is being reinforced by rising electricity consumption from AI data centers, which is driving demand for high-voltage, high-power power management components used in servers and related infrastructure.