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Samsung boosts HBM4 DRAM investment to secure market leadership

Samsung Electronics is set to begin mass production of the world’s first sixth-generation high-bandwidth memory (HBM4) chips later in February 2026, marking a major milestone in the race to supply critical components for next-generation AI hardware. Industry sources cited by the Yonhap News Agency say shipments could start as early as next week, following the Lunar New Year holiday, with Nvidia among the first customers.