TSMC has solidified its critical role in the global semiconductor supply chain through nearly two decades of strategic investment in advanced packaging, positioning itself at the forefront of the AI era. Shang-Yi Chiang, a key figure dubbed one of the “Six Knights of TSMC R&D,” reflected on how the company laid the groundwork early for AI-driven growth by pioneering CoWoS and InFO technologies.
TSMC’s 20-year advanced packaging strategy secures Apple and Nvidia ties
05
Mar