The explosive growth in artificial intelligence (AI) servers and high-performance computing (HPC) is driving up the value of key components like ABF substrates. With ongoing bottlenecks in the global supply chain for advanced packaging substrates, South Korea’s Samsung Electro-Mechanics (Semco) has proactively restructured its product lineup and increased prices. This move reflects not only rising raw material costs but also a structural shift where demand far exceeds supply.