Brand Cheng, chairman of Foxconn Industrial Internet (FII), a cloud networking business under Foxconn, recently announced ongoing advancements in technologies, including co-packaged optics (CPOs), liquid cooling, power architectures, and PCB technology. Notably, FII completed prototype shipments of its CPO all-optical switch in the first quarter of 2026 and plans to begin mass production starting in the third quarter of 2026.