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NEO Semiconductor advances 3D DRAM with POC validation

Driven by AI, demand for high-bandwidth memory (HBM) is surging, causing a supply shortage in DRAM and prompting cloud service providers to pre-book capacity for the next two years. The rising need for larger HBM capacities is expected to grow exponentially, while 3D DRAM technology emerges as a solution to overcome current process scaling limits.