Amkor, the world’s second-largest OSAT provider, recently held its earnings call where CEO Kevin Engel highlighted strong demand for AI and high-performance computing (HPC) chips driving robust orders for advanced packaging technologies like high-density fan-out (HDFO) and flip-chip. The company’s HDFO packaging platform, which had already shipped two PC chip models, has now successfully integrated an AI data center CPU application set to enter mass production in the second quarter of 2026.