Latest News and Trends

Samsung reportedly speeds up 3D NAND, packaging, and substrate plans

Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after more than a year of prioritizing DRAM design and high-bandwidth memory (HBM) competitiveness. The move signals a shift from catch-up mode back toward longer-term technology investment.