SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published roadmap proposing to extend co-packaged optics (CPO) to the memory interface, the company increasingly appears to be competing not just over the next generation of HBM, but over how future artificial intelligence (AI) systems organize and access memory.