At the Semicon Network Summit 2026, speakers from Marvell, the Netherlands Organisation for Applied Scientific Research’s Holst Centre, the UK Semiconductor Centre, and the Taiwan Semiconductor Industry Association (TSIA) discussed the future of silicon photonics (SiPh). They said the industry’s bottlenecks have shifted from materials to packaging precision, materials platform selection, and the manufacturing tools needed to support both.
CPO material race widens as Taiwan eyes key role
03
Sep