Solomon Technology, a Taiwanese artificial intelligence (AI) 3D vision company, is showcasing two key inspection applications that integrate its core AI vision and optical technologies at Semicon Taiwan 2026. The applications include full-wafer warpage detection inside front-opening unified pods (FOUP)/cassettes and through-glass via (TGV) aperture defect inspection technology, aimed at preventing equipment downtime during manufacturing processes and ensuring the yield and quality of next-generation advanced packaging.