To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving from traditional one-dimensional layouts to high-density two-dimensional (2D) architectures, raising the bar for hole positioning accuracy, micro-hole size, packing density, and process stability. At SEMICON Taiwan 2026, semiconductor equipment maker E&R Engineering unveiled a new ultra-high-precision laser micromachining platform with integrated high-precision motion control, laser drilling, and micromachining technologies.