The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan’s three leading IC substrate suppliers, Unimicron, Kinsus, and Nanya PCB, to restart capacity expansion targeting GPU, CPU, and ASIC customers.
AMD opens EFB front beyond CoWoS, putting Taiwan substrate trio in play
16
Jun