Leading IC packaging and testing company, ASE, has been consistently highlighting silicon photonics (SiPh) as a future trend since the latter half of 2023. CEO Dr. Tien Wu stated that the computing capability necessary for future AI applications could be several times larger than current values, potentially up to tenfold. He emphasized that current AI chips are insufficient to support future computing needs, and the key to increasing chip capability lies in SiPh technology.