Chunghwa Telecom plans to commercialize 6G by 2030 and is preparing by signing a memorandum with Nokia. They will explore 5G Advanced, 6G, and AI technologies to enhance services and stay competitive.

With geopolitical pressures intensifying rapidly after Trump’s inauguration as President of the US, TSMC announced on March 4, 2025, that it would invest an additional US$100 billion in the US. However, this new investment plan still tests the Trump administration’s ability to address issues related to factory construction and talent shortages.

After expanding into the LED bicycle light and electric-assisted bicycle markets, PCB manufacturer Eiso Industrial has formally joined TSS Holdings. The move is part of the company’s strategy to collaborate with fellow members and strengthen its global footprint. Eiso plans to focus on high-value applications for its core PCB material research and production, particularly in satellite communications, aerospace, and 5G technologies. Additionally, the company is ramping up operations at its Guishan factory to meet the growing demands of these emerging markets.

Wafer-probing specialist Ardentec anticipates commencing operations at its new plant in Longtan, northern Taiwan, in the second quarter of 2025.